Manager, Semiconductor IC Packaging & Assembly Engineering at Renesas Electronics - Undisclosed
Role Summary
The Manager will be responsible for leading the semiconductor IC packaging and assembly engineering team at Renesas Electronics. This position requires a blend of technical expertise and managerial skills to enhance production processes.
Job Description
Renesas Electronics is seeking a Manager for Semiconductor IC Packaging & Assembly Engineering. This role involves overseeing the packaging and assembly processes of semiconductor integrated circuits, ensuring quality and efficiency in production. The successful candidate will lead a team, manage projects, and collaborate with cross-functional departments to drive innovation and improvement in packaging technologies.
Job Requirements
Bachelor's degree in Engineering or related field
Experience in semiconductor packaging and assembly
Strong leadership and project management skills
Ability to work collaboratively in a team environment
Excellent problem-solving and analytical skills
Manager, Semiconductor IC Packaging & Assembly Engineering - Frequently Asked Questions
What is the salary for a Manager, Semiconductor IC Packaging & Assembly Engineering at Renesas Electronics in Undisclosed?
Renesas Electronics has not disclosed the salary for this role. Manager, Semiconductor IC Packaging & Assembly Engineering positions in Undisclosed typically pay RM800–RM10,000 per month, based on the 171 comparable vacancies currently listed on SuperJobs.
Where is this Manager, Semiconductor IC Packaging & Assembly Engineering job located?
This Manager, Semiconductor IC Packaging & Assembly Engineering position is based in Undisclosed, Malaysia. This role is fully on-site.
What qualifications do I need for this Manager, Semiconductor IC Packaging & Assembly Engineering role?
Renesas Electronics is looking for Bachelor's degree in Engineering or related field; Experience in semiconductor packaging and assembly; Strong leadership and project management skills.
How do I apply for this Manager, Semiconductor IC Packaging & Assembly Engineering job at Renesas Electronics?
Apply directly on SuperJobs — create a free profile, upload your CV once and submit. There is no agency fee and no charge to applicants. Applications close 2026-11-08.
Quick Info
Company
Renesas Electronics
Location
Undisclosed
Salary
Undisclosed
Skills Required
5 skills
Click to submit your application
Required Skills
Manager, Semiconductor IC Packaging & Assembly Engineering Salary at Renesas Electronics
Renesas Electronics has not disclosed the salary for this role. Manager, Semiconductor IC Packaging & Assembly Engineering positions in Undisclosed typically pay RM800–RM10,000 per month, based on the 171 comparable vacancies currently listed on SuperJobs.
How to Apply for This Manager, Semiconductor IC Packaging & Assembly Engineering Role
- Click Apply Now and sign in, or create a free SuperJobs profile. It takes about two minutes and there is no agency fee.
- Upload your CV once and answer any screening questions Renesas Electronics asks. Your profile is reused for every application after this one.
- Submit, then track the application and any employer replies from your dashboard. Applications close 2026-11-08, so apply early.
Application Tips
- Ensure your resume highlights relevant skills and experience
- Tailor your application to match the role requirements
- Double-check all information before submitting
- Submit your application as soon as possible to increase your chances
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