Senior Manager, Semiconductor IC Packaging & Assembly Engineering at Renesas Electronics - Undisclosed
Role Summary
The Senior Manager will be responsible for leading the Semiconductor IC Packaging & Assembly Engineering team at Renesas Electronics. This role requires a blend of technical expertise and managerial skills to enhance production processes.
Job Description
Renesas Electronics is seeking a Senior Manager for its Semiconductor IC Packaging & Assembly Engineering team. This role involves overseeing the packaging and assembly processes, ensuring high-quality standards and efficiency in production. The successful candidate will lead a team of engineers and collaborate with cross-functional departments to drive innovation and improve operational performance.
Job Requirements
Bachelor's degree in Electrical Engineering or related field
Minimum 5 years of experience in semiconductor packaging and assembly
Strong leadership and team management skills
Proficient in project management and process optimization
Excellent communication and problem-solving abilities
Senior Manager, Semiconductor IC Packaging & Assembly Engineering - Frequently Asked Questions
What is the salary for a Senior Manager, Semiconductor IC Packaging & Assembly Engineering at Renesas Electronics in Undisclosed?
Renesas Electronics has not disclosed the salary for this role. Senior Manager, Semiconductor IC Packaging & Assembly Engineering positions in Undisclosed typically pay RM800–RM10,000 per month, based on the 171 comparable vacancies currently listed on SuperJobs.
Where is this Senior Manager, Semiconductor IC Packaging & Assembly Engineering job located?
This Senior Manager, Semiconductor IC Packaging & Assembly Engineering position is based in Undisclosed, Malaysia. This role is fully on-site.
What qualifications do I need for this Senior Manager, Semiconductor IC Packaging & Assembly Engineering role?
Renesas Electronics is looking for Bachelor's degree in Electrical Engineering or related field; Minimum 5 years of experience in semiconductor packaging and assembly; Strong leadership and team management skills.
How do I apply for this Senior Manager, Semiconductor IC Packaging & Assembly Engineering job at Renesas Electronics?
Apply directly on SuperJobs — create a free profile, upload your CV once and submit. There is no agency fee and no charge to applicants. Applications close 2026-11-08.
Quick Info
Company
Renesas Electronics
Location
Undisclosed
Salary
Undisclosed
Skills Required
5 skills
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Required Skills
Senior Manager, Semiconductor IC Packaging & Assembly Engineering Salary at Renesas Electronics
Renesas Electronics has not disclosed the salary for this role. Senior Manager, Semiconductor IC Packaging & Assembly Engineering positions in Undisclosed typically pay RM800–RM10,000 per month, based on the 171 comparable vacancies currently listed on SuperJobs.
How to Apply for This Senior Manager, Semiconductor IC Packaging & Assembly Engineering Role
- Click Apply Now and sign in, or create a free SuperJobs profile. It takes about two minutes and there is no agency fee.
- Upload your CV once and answer any screening questions Renesas Electronics asks. Your profile is reused for every application after this one.
- Submit, then track the application and any employer replies from your dashboard. Applications close 2026-11-08, so apply early.
Application Tips
- Ensure your resume highlights relevant skills and experience
- Tailor your application to match the role requirements
- Double-check all information before submitting
- Submit your application as soon as possible to increase your chances
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