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By SuperJobs Career Team · Updated May 2026
Malaysia is one of the world's most important technology-hardware manufacturing hubs, with the Penang corridor earning its reputation as the "Silicon Valley of the East". The sector covers semiconductor design and fabrication, electronics assembly, printed circuit board (PCB) manufacturing, test and measurement equipment, and consumer electronics production.
Global semiconductor giants have anchored significant operations here: Intel (Penang — one of its largest global assembly and test sites), Infineon Technologies, Western Digital, Micron Technology, Osram, Bosch, Texas Instruments, and On Semiconductor. Domestic players such as Unisem, MPI (Malaysian Pacific Industries), and Globetronics Technology complement the multinational ecosystem, particularly in Penang's Bayan Lepas Free Industrial Zone.
The government's New Industrial Master Plan 2030 (NIMP 2030) targets Malaysia's elevation from assembly and packaging into higher-value chip design, advanced packaging (FOWLP, 3D-IC), and compound semiconductors — creating demand for a new generation of hardware engineers, process technologists, and R&D specialists alongside traditional test and assembly roles.
Hardware and semiconductor roles carry a premium over general manufacturing. Process and test engineers earn RM 3,500 – RM 6,500/month at entry to mid-level. Senior engineers and module owners earn RM 6,500 – RM 12,000/month. Principal engineers and R&D leads command RM 12,000 – RM 22,000/month, with multinational premiums pushing top talent packages above RM 25,000/month including bonuses.
Penang continues to offer a meaningful salary premium of 15–25% over equivalent roles in the Klang Valley for hardware engineers due to the concentration of global semiconductor fabs. The hottest sub-specialisations are advanced packaging, IC design (VLSI, ASIC), failure analysis, and equipment engineering for EUV and advanced lithography nodes. Hardware security and automotive-grade semiconductor roles (IATF 16949, AEC-Q100) are the fastest-growing segments in 2025.
Develops and optimises fabrication and assembly processes in wafer fabs and OSAT (outsourced semiconductor assembly and test) facilities.
Designs and validates automated test equipment (ATE) programmes for IC, PCB, and module-level testing on the production line.
Maintains, qualifies, and improves semiconductor manufacturing equipment — from wire bonders to advanced lithography systems.
Designs digital, analogue, or mixed-signal integrated circuits using tools like Cadence Virtuoso, Synopsys, and Mentor Graphics.
Investigates root causes of device failures using SEM, TEM, FIB, and electrical characterisation tools to drive yield improvement.
Qualifies new products and processes against JEDEC and automotive reliability standards, managing customer quality relationships.
Search SuperJobs by role ("process engineer", "test engineer", "IC design", "equipment engineer") and location — Penang, Kulim, and Melaka are the primary hardware industry clusters.
Highlight your degree discipline (Electrical & Electronic Engineering, Microelectronics, Materials Engineering) and any final-year projects with semiconductor or electronics relevance.
List specific equipment platforms, EDA tools (Cadence, Synopsys, Mentor), and programming languages (Python, C++, LabVIEW, MATLAB) used in prior roles or academic projects.
Apply through SuperJobs and also via company career portals — Intel, Infineon, and Western Digital run structured graduate intake programmes with competitive selection processes.
Prepare for technical interviews covering your engineering discipline fundamentals, failure analysis methodology (8D, FTA, Fishbone), and any process or yield improvement projects you have led.