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Package Reliability Process Engineer at Micron Memory Malaysia Sdn. Bhd. - Kuala Lumpur

Micron Memory Malaysia Sdn. Bhd.
Kuala Lumpur
Salary: Undisclosed

This job is no longer accepting applications.

It was posted on 21 May 2026 and has passed its 30-day listing period. See open Process Engineer jobs.

Role Summary

The Package Reliability Process Engineer is responsible for defining and coordinating area projects to ensure process reliability. This role significantly impacts the quality and performance of packaging processes within the organization.

Job Description

The Package Reliability Process Engineer at Micron Technology Inc. engages in day-to-day activities that involve analyzing resource utilization and evaluating new equipment needs while collaborating with internal and external customers. The engineer plays a crucial role in managing team performance and development, providing feedback, and promoting career growth.

Key Responsibilities:

  • Manage new process qualifications by defining and facilitating qualification plans.
  • Analyze failures and failure rates to improve process reliability.
  • Perform risk assessments to identify potential issues in process qualifications.
  • Develop process reliability methodologies in collaboration with Research and Development teams.
  • Coordinate the development of tests and analyze results to ensure compliance with industry standards.
  • Support excursion material disposition by assessing risks and managing evaluations.
  • Provide guidance and advice to internal and external customers regarding process reliability.

Job Requirements

Bachelor's degree in Engineering or related field.

Experience in process engineering and reliability testing.

Strong communication and interpersonal skills.

Ability to manage and develop a team.

Knowledge of risk assessment and failure analysis.

Familiarity with industry standards such as JEDEC.

Package Reliability Process Engineer - Frequently Asked Questions

What is the salary for a Package Reliability Process Engineer at Micron Memory Malaysia Sdn. Bhd. in Kuala Lumpur?

Micron Memory Malaysia Sdn. Bhd. has not disclosed the salary for this role. Package Reliability Process Engineer positions in Kuala Lumpur typically pay RM3,000–RM12,000 per month, based on the 14 comparable vacancies currently listed on SuperJobs.

Where is this Package Reliability Process Engineer job located?

This Package Reliability Process Engineer position is based in Kuala Lumpur, Malaysia. This role is fully on-site.

What qualifications do I need for this Package Reliability Process Engineer role?

Micron Memory Malaysia Sdn. Bhd. is looking for Bachelor's degree in Engineering or related field.; Experience in process engineering and reliability testing.; Strong communication and interpersonal skills..

How do I apply for this Package Reliability Process Engineer job at Micron Memory Malaysia Sdn. Bhd.?

This job is no longer accepting applications. Similar roles that are hiring now are linked on this page, and you can apply to those directly on SuperJobs with no agency fee.

Quick Info

Company

Micron Memory Malaysia Sdn. Bhd.

Location

Kuala Lumpur

Salary

Undisclosed

Skills Required

6 skills

Required Skills

Process EngineeringReliability TestingRisk AssessmentTeam ManagementCommunicationAnalytical Skills

Package Reliability Process Engineer Salary at Micron Memory Malaysia Sdn. Bhd.

Micron Memory Malaysia Sdn. Bhd. has not disclosed the salary for this role. Package Reliability Process Engineer positions in Kuala Lumpur typically pay RM3,000–RM12,000 per month, based on the 14 comparable vacancies currently listed on SuperJobs.

How to Apply for Similar Package Reliability Process Engineer Roles

  1. This job is no longer accepting applications.
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  3. Create a free SuperJobs profile once and reuse it for every application. There is no agency fee.

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