Staff/Senior/Engineer CE PYE (Physical Failure Analysis) – Micron Memory Malaysia Sdn. Bhd.
Micron Memory Malaysia Sdn. Bhd.
Technology-Hardware
Role Summary
The Physical Failure Analysis Engineer at Micron Technology provides fault isolation and failure analysis support for qualification, customer returns, new device introduction, and general test failures. The engineer works with Product Engineering Teams to become a domain expert on fault isolation and physical failure analysis methods related to the product's architecture, process, and test sequences.
Job Description
The role involves providing fault isolation and failure analysis support for qualification, customer returns, new device introduction, and general test failures within Micron Technology's Central Engineering Product Yield Improvement team. The engineer will become a domain expert on fault isolation and physical failure analysis methods, working closely with Product Engineering Teams to understand relevant methods and the product's architecture, process, and test sequences.
Job Requirements
A Bachelor's or equivalent experience or Master's or PhD degree in Electrical/Electronic Engineering is required.
The candidate must be a phenomenal teammate with analytical, problem-solving skills and a strong drive to excel.
Excellent interpersonal skills and the ability to present in large meetings are required.
Candidates should be highly motivated individuals.
Knowledge of fault isolation equipment, techniques, or physical failure analysis is an added advantage.
Strong understanding of non-volatile NAND devices and knowledge of Fab process is an added advantage.
Candidates must be able to support shift rotation.
Quick Info
Company
Micron Memory Malaysia Sdn. Bhd.
Location
Kuala Lumpur
Salary
Undisclosed
Skills Required
10 skills
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Required Skills
Fault Isolation
Failure Analysis
Electrical Engineering
Problem Solving
Interpersonal Communication
Teamwork
Technical Presentations
Non-Volatile Memory Knowledge
Semiconductor Fabrication Processes
Analytical Thinking
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