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The TechOps Engineer internship offers an opportunity to gain practical experience in IT operations within a retail environment. Interns will provide technical support, manage user issues, and assist in system monitoring and documentation.
The L1 Support Engineer role involves providing onsite systems and network support to clients, including troubleshooting and resolving issues related to servers, networking equipment, and user systems. The position requires managing customer case tickets, collaborating with Level 2 Support teams, and participating in desktop workflow processes such as onboarding and offboarding.
This position is for a Manager in Systems/Applications Engineering based in Penang, Malaysia. The role involves leading teams that design, integrate, and manage complex systems throughout their life cycles while collaborating with cross-functional groups to ensure high-quality product development. The manager is responsible for overseeing technical solutions, project planning, customer interactions, and maintaining industry standards within a hardware engineering context.
The Senior Exec I, Inside Sales role involves providing technical support to end-users by troubleshooting hardware, software, and connectivity issues. The position includes installing and upgrading computers and peripherals, performing maintenance and system updates, and ensuring compliance with data security policies while collaborating with ICT teams and supporting users.
This role involves providing technical support to end-users onsite, including troubleshooting hardware, software, and connectivity issues. The position includes installing, configuring, and maintaining computers and peripheral devices, assisting staff with software and application support, and ensuring compliance with security protocols.
The Exec II, Services Marketing & Planning role focuses on providing technical support to end-users through troubleshooting, device installation, routine maintenance, and ensuring compliance with security standards. The role also involves educating users on best practices, maintaining IT asset records, and collaborating with the ICT team to resolve technical issues.
This role is for a Data Center Technician responsible for maintaining critical systems in a high-tech environment. The position involves technical work and problem-solving within Malaysia's growing data sector.
The Field Application Engineer at AMD provides technical support to enterprise customers, server OEM/ODM, and ISV partners utilizing AMD EPYC-based servers. This role involves addressing technical and product issues related to customers' workloads or applications across various communication channels, requiring some travel.
This role is a Global Infrastructure Services Intern position focused on IT automation. The role involves creating tools to simplify technical tasks and collaborating with a global team while developing skills in diverse technology environments.
The Global Network Management Engineer (Monitor & Control) at Motorola Solutions is responsible for implementing proactive network management strategies to ensure high availability and resilience of the global network infrastructure. The role involves utilizing AI and advanced network management tools to predict and prevent service disruptions while collaborating with cross-functional teams globally.
The Senior Multi Channel Helpdesk Specialist role involves providing customer support and improving customer experience within the ISV and Hi-Tech domains. The position requires native-level proficiency in Korean translation and communication, operating in a hybrid work model with day shifts.
The Infra Build - Cloud Network Engineer role involves building and managing network setups within an AWS cloud environment and integrating them with on-premises networks. The position requires hands-on configuration, testing, documentation, and collaboration with various teams to support network infrastructure components and connectivity.
By SuperJobs Career Team · Updated May 2026
Malaysia is one of the world's most important technology-hardware manufacturing hubs, with the Penang corridor earning its reputation as the "Silicon Valley of the East". The sector covers semiconductor design and fabrication, electronics assembly, printed circuit board (PCB) manufacturing, test and measurement equipment, and consumer electronics production.
Global semiconductor giants have anchored significant operations here: Intel (Penang — one of its largest global assembly and test sites), Infineon Technologies, Western Digital, Micron Technology, Osram, Bosch, Texas Instruments, and On Semiconductor. Domestic players such as Unisem, MPI (Malaysian Pacific Industries), and Globetronics Technology complement the multinational ecosystem, particularly in Penang's Bayan Lepas Free Industrial Zone.
The government's New Industrial Master Plan 2030 (NIMP 2030) targets Malaysia's elevation from assembly and packaging into higher-value chip design, advanced packaging (FOWLP, 3D-IC), and compound semiconductors — creating demand for a new generation of hardware engineers, process technologists, and R&D specialists alongside traditional test and assembly roles.
Hardware and semiconductor roles carry a premium over general manufacturing. Process and test engineers earn RM 3,500 – RM 6,500/month at entry to mid-level. Senior engineers and module owners earn RM 6,500 – RM 12,000/month. Principal engineers and R&D leads command RM 12,000 – RM 22,000/month, with multinational premiums pushing top talent packages above RM 25,000/month including bonuses.
Penang continues to offer a meaningful salary premium of 15–25% over equivalent roles in the Klang Valley for hardware engineers due to the concentration of global semiconductor fabs. The hottest sub-specialisations are advanced packaging, IC design (VLSI, ASIC), failure analysis, and equipment engineering for EUV and advanced lithography nodes. Hardware security and automotive-grade semiconductor roles (IATF 16949, AEC-Q100) are the fastest-growing segments in 2025.
Develops and optimises fabrication and assembly processes in wafer fabs and OSAT (outsourced semiconductor assembly and test) facilities.
Designs and validates automated test equipment (ATE) programmes for IC, PCB, and module-level testing on the production line.
Maintains, qualifies, and improves semiconductor manufacturing equipment — from wire bonders to advanced lithography systems.
Designs digital, analogue, or mixed-signal integrated circuits using tools like Cadence Virtuoso, Synopsys, and Mentor Graphics.
Investigates root causes of device failures using SEM, TEM, FIB, and electrical characterisation tools to drive yield improvement.
Qualifies new products and processes against JEDEC and automotive reliability standards, managing customer quality relationships.
Search SuperJobs by role ("process engineer", "test engineer", "IC design", "equipment engineer") and location — Penang, Kulim, and Melaka are the primary hardware industry clusters.
Highlight your degree discipline (Electrical & Electronic Engineering, Microelectronics, Materials Engineering) and any final-year projects with semiconductor or electronics relevance.
List specific equipment platforms, EDA tools (Cadence, Synopsys, Mentor), and programming languages (Python, C++, LabVIEW, MATLAB) used in prior roles or academic projects.
Apply through SuperJobs and also via company career portals — Intel, Infineon, and Western Digital run structured graduate intake programmes with competitive selection processes.
Prepare for technical interviews covering your engineering discipline fundamentals, failure analysis methodology (8D, FTA, Fishbone), and any process or yield improvement projects you have led.