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The ITSM Technology Support Engineer role focuses on Business Integration and Automation Engineering Projects, particularly involving Data Historian (AVEVA PI) administration and development. The position includes responsibilities related to incident, change, and problem management, as well as managing interfaces between the Data Historian and other data sources, and supporting integration projects involving reporting, big data analysis, and production automation.
The Service Technician I role at Stanley Black & Decker involves working as part of a collaborative team within a global company that supports several well-known brands. The position requires basic technical skills, good communication, and adherence to safety standards while contributing to the service and maintenance functions.
This internship role involves assisting in the management of customer equipment returns. The position offers practical experience in technical operations, inventory management, and repair processes.
The DSD – Mobile Assistant role involves managing and maintaining equipment related to the SAP Direct Store Delivery application, supporting business operations through technical assistance and hardware management. The position requires knowledge of the SAP DSD application and business processes in sales and distribution, with a focus on problem-solving and teamwork.
The Junior Application Support Engineer role involves supporting technology systems to ensure their smooth operation. The position includes troubleshooting issues related to technologies such as Linux and databases.
This role is for a Network Engineer with experience in data center network implementation, including design, planning, and troubleshooting. The position focuses on working with F5 load balancers and Palo Alto firewalls, as well as supporting network design and deployment projects within edge services.
The IT Infrastructure Engineer is responsible for managing and maintaining Windows Server environments along with associated network services such as Active Directory, DNS, and DHCP. The role includes Microsoft 365 administration, managing user permissions, troubleshooting Windows issues, and performing regular server maintenance and backup activities. Additionally, the position involves managing antivirus solutions, firewall settings, and log maintenance to support system security and stability.
This internship role involves designing, building, testing, and deploying IoT-based solutions for clinics, devices, sensors, and smart operational systems. The position requires supporting technology and innovation initiatives in healthcare technology through hardware-software integration.
The Head of IT Network Communications at Genting Malaysia Berhad is responsible for providing technical leadership on communication-related solutions and managing the IT lifecycle for network and communication systems. This role involves overseeing projects, designing communication solutions, developing disaster recovery strategies, and leading a team of IT professionals in Kuala Lumpur and Resorts World Genting.
The role is for an Engineer in Client Services responsible for maintaining a stable IT platform on a global scale. The position involves working with advanced technology and supporting clients in addressing technical issues.
The Toolcrib Technician manages tools and equipment to support maintenance activities in an aviation environment. This role includes ensuring the availability and proper condition of tools, administering spares and materials, and maintaining tool calibration and records.
The Channel Marketing Internship involves providing technical support to end-users by troubleshooting hardware, software, and connectivity issues, as well as setting up and maintaining devices. The role includes tasks such as installing and upgrading computers, deploying devices to new employees, and maintaining IT asset records. The position requires effective communication skills, a basic understanding of hardware and software, teamwork, adaptability, and adherence to security protocols.
By SuperJobs Career Team · Updated May 2026
Malaysia is one of the world's most important technology-hardware manufacturing hubs, with the Penang corridor earning its reputation as the "Silicon Valley of the East". The sector covers semiconductor design and fabrication, electronics assembly, printed circuit board (PCB) manufacturing, test and measurement equipment, and consumer electronics production.
Global semiconductor giants have anchored significant operations here: Intel (Penang — one of its largest global assembly and test sites), Infineon Technologies, Western Digital, Micron Technology, Osram, Bosch, Texas Instruments, and On Semiconductor. Domestic players such as Unisem, MPI (Malaysian Pacific Industries), and Globetronics Technology complement the multinational ecosystem, particularly in Penang's Bayan Lepas Free Industrial Zone.
The government's New Industrial Master Plan 2030 (NIMP 2030) targets Malaysia's elevation from assembly and packaging into higher-value chip design, advanced packaging (FOWLP, 3D-IC), and compound semiconductors — creating demand for a new generation of hardware engineers, process technologists, and R&D specialists alongside traditional test and assembly roles.
Hardware and semiconductor roles carry a premium over general manufacturing. Process and test engineers earn RM 3,500 – RM 6,500/month at entry to mid-level. Senior engineers and module owners earn RM 6,500 – RM 12,000/month. Principal engineers and R&D leads command RM 12,000 – RM 22,000/month, with multinational premiums pushing top talent packages above RM 25,000/month including bonuses.
Penang continues to offer a meaningful salary premium of 15–25% over equivalent roles in the Klang Valley for hardware engineers due to the concentration of global semiconductor fabs. The hottest sub-specialisations are advanced packaging, IC design (VLSI, ASIC), failure analysis, and equipment engineering for EUV and advanced lithography nodes. Hardware security and automotive-grade semiconductor roles (IATF 16949, AEC-Q100) are the fastest-growing segments in 2025.
Develops and optimises fabrication and assembly processes in wafer fabs and OSAT (outsourced semiconductor assembly and test) facilities.
Designs and validates automated test equipment (ATE) programmes for IC, PCB, and module-level testing on the production line.
Maintains, qualifies, and improves semiconductor manufacturing equipment — from wire bonders to advanced lithography systems.
Designs digital, analogue, or mixed-signal integrated circuits using tools like Cadence Virtuoso, Synopsys, and Mentor Graphics.
Investigates root causes of device failures using SEM, TEM, FIB, and electrical characterisation tools to drive yield improvement.
Qualifies new products and processes against JEDEC and automotive reliability standards, managing customer quality relationships.
Search SuperJobs by role ("process engineer", "test engineer", "IC design", "equipment engineer") and location — Penang, Kulim, and Melaka are the primary hardware industry clusters.
Highlight your degree discipline (Electrical & Electronic Engineering, Microelectronics, Materials Engineering) and any final-year projects with semiconductor or electronics relevance.
List specific equipment platforms, EDA tools (Cadence, Synopsys, Mentor), and programming languages (Python, C++, LabVIEW, MATLAB) used in prior roles or academic projects.
Apply through SuperJobs and also via company career portals — Intel, Infineon, and Western Digital run structured graduate intake programmes with competitive selection processes.
Prepare for technical interviews covering your engineering discipline fundamentals, failure analysis methodology (8D, FTA, Fishbone), and any process or yield improvement projects you have led.